Our MOEMS services for you

• Cleanroom ISO class 7 according to ISO 14644-1 (previously class 10’000)
• Laminar flow box ISO class 5 according ISO 14644-1 (previously class 100)
• Die Bonding and Wire Bonding of optical chips
• Precision encapsulation
• Precision alignment of optical components
• Box Build & Functional testing

Die Bonding
Highly flexible Die Bonder with small setup times and many options

• Stamping or Dispensing of Adhesives
• Pick & Place of bare chips from Blue tape, Waffle Pack or Gel Pack
• Chip sizes typically 0.3 – 25 mm edge length
• Flipping unit for Flip Chip assembly
• 60-100 cph

Die Bonding
Flexible and fast Die Bonder with small setup times and many available options

• Stamping or Dispensing of Adhesives
• Pick & Place of bare chips from Blue tape, Waffle Pack or Gel Pack
• Chip sizes typically 0.3 – 10 mm edge length
• 330 cph (real production)

Wire Bonding
Flexible Ultrasonic Wedge/Wedge Bonder

• Wire material: aluminum or gold
• Wire diameter typ. 17-32 micrometers
• Minimal Loop height typ. 200 micrometers (other values see COB Design Rules)
• Substrate heating

Mechanical Testing

• Pull and Shear test
• Destructive and non destructive
• Pull test up to 800g, Shear test up to 40kg
• Archiving of measurement results in database
• Recording of force-displacement-diagram

Encapsulation

• Automatic 2-head dispensing system
• State-of-the-art Jet technology
• Mass calibrated dispensing
• Vision system for precise  dispensing
• Various valves for a wide spectrum of materials (low to high viscosity)

Optoelectronics Assembly
Custom design set-up for positioning and placement of optoelectronic components

• Video microscope with motorized translation & rotation stages
• Optical alignment relative to inner structure of components
• Fixation with UV-curing glue