Electronics manufacturing services (EMS) provider ESCATEC’s business unit in Penang, ESCATEC Electronics Sdn Bhd (EEM), recently welcomed the installation of an advanced Ersa POWERFLOW ULTRA wave soldering system, strengthening its capabilities and production capacity for customers bringing complex high-tech products to market.
The new equipment underwent several weeks of engineering evaluation and testing at the site and has now been put into production, making it the third wave soldering system currently operational at EEM.
EEM's SMT, equipment & maintenance manager, Ivan Tan Teng Hock,
welcomes his new wave soldering system.
The investment enhances EEM’s ability to meet increasing customer demand for advanced and high-quality services capable of integrating emerging technologies into products. It also reflects the broader direction underway at all ESCATEC business units globally toward increased automation, digital integration, and smart manufacturing, across all facilities.
For reference, the POWERFLOW ULTRA is a full-tunnel, lead-free wave soldering system designed for high flexibility and throughput. Its features include a modular preheating section of up to five convection and infrared zones, dual-wave soldering technology for precise process control, and a nitrogen-controlled environment to ensure consistent solder quality. The system supports PCB widths up to 610 mm and operates on Ersa’s latest ERSASOFT 5 platform, which enables automated operation, continuous process monitoring, and data integration, with ESCATEC’s manufacturing system.
"To provide a high level of service to customers and to strengthen existing partnerships, ESCATEC will continue to focus on acquiring the highest level of technology that is also agile and can be integrated with our existing digital systems, in order to provide full real-time control and traceability,” said ESCATEC COO, Alessandro Marinai.
ESCATEC COO, Alessandro Marinai
Headquartered in Penang, ESCATEC offers a full spectrum of EMS services - from design & development to certification to mass manufacturing and after-sales support - across electronics, mechatronics, machining, microelectronics, box build, and plastic moulding.
The Group currently operates four production sites in Malaysia, two in the Czech Republic, one in the United Kingdom, one in Bulgaria, and an advanced microelectronics production facility in Switzerland. It also operates a Design & Development (D&D) Centre in Switzerland and has strategic design & production partnerships in Croatia and the United States.
Media enquiries can be directed to Mr. Rajeshpal Singh, Corporate Marketing & Communications Manager, at rajeshpal.singh@escatec.com, Tel: +604 6113 456.