09 Nov, 2023 / BY Daniel Schultze

The future of electronics manufacturing: a conversation with Tresky's CEO

As part of our series of Q&A articles with influencers in the electronics manufacturing world, we recently spoke to Daniel Schultze CEO of Tresky.  

Tresky – at the cutting edge of electronics manufacturing

For over forty years, the German company Tresky has specialised in providing manual and semi-automatic Die Bonding solutions tailored for small to medium electronics assembly units, research labs, and R&D centres. Today, Tresky is a market leader in handling technology and pick & place systems.

In 2023 the company unveiled their new pre-sintering process to the public at various events around the world. Demonstrating these new capabilities, Daniel Schultze, CEO of Tresky, explained:

In the sintering process, the chip is bonded to the substrate by silver or copper paste, not only electrically but also thermally. This is done with the help of heat and pressure. In this process, the silver particles are bonded together by diffusion processes. The advantage is the very high thermomechanical stability, which is particularly needed in power electronics.” 

As Tresky continue to roll out their latest innovations, we wanted to find out more.

In conversation with Daniel Schultze

We caught up with Daniel last month to ask him about Tresky’s plans and his view of the future of the electronics manufacturing sector.

How have the first 6 months of 2023 been for your business?

Due to our further development of the sintering process, we are seeing strong demand from the e-mobility sector and a high level of incoming orders. The large international automotive manufacturers, in particular, are very interested in the possibilities of sintering with copper and silver paste – and the DTF process.

What emerging technologies or trends do you see shaping the future of electronics manufacturing? How is your company preparing to adapt to these changes?

Our sintering process for Power Modules offers significant time-to-market and cost reduction in the the development of power converters. Our customers are benefiting from our extensive experience in electronics, semiconductor and DIE attach applications. We saw the potential of this development early on and have expedited it. And we're not finished yet! We'll be presenting further innovations in the coming months, such as our SQ-Nozzle, which enables paste depots to be applied sequentially, very precisely and over a large area, even with very thixotropic silver pastes.

What new equipment, tools, or machinery are you most excited about? How do you anticipate these innovations will impact the overall manufacturing process?

We’ve presented a number of innovations this year at various trade shows worldwide and on social media and we also have other new products in the pipeline.  But we want to offer the sintering process to as broader target group as possible. For this, we have to provide the right information to the clients throughout the supply chain and present the process reliability.  We want to work with other companies that are responsible for upstream and downstream processes related to sintering, offering our target customers the entire sintering process from a single source. In this way, we can significantly reduce the entry and implementation effort.

Are you seeing any notable shifts in terms of customer demand for certain products? If so, what is driving this change in demand?  

Enquiries about sinter bonding for Power Modules are currently dominating. Of course, e-mobility and renewable energies are the drivers here.

What advancements in automation and/or robotics do you see playing a significant role in the electronics manufacturing industry?

All industrial companies in Europe are suffering from a shortage of skilled workers. In future industrial production will increasingly rely on reliable automation, the use of autonomous systems and the introduction of AI. This applies to the electronics industry, too. In addition, machines have to be set up and operated easily and intuitively. We at Tresky attached great importance to this early on. Implementing new work steps in our bonder system is extremely easy and does not require days of training.

How do you see digitalisation, data analytics, and IoT technologies integrating into the equipment you supply? What challenges exist?

They are all necessary components for reliable, effective and reproducible semiconductor production, both today and in the future. As a result, the topics of IT infrastructure and security are becoming increasingly important.

Are there any partnerships or collaborations your company has established with other industry players which will help accelerate the development of new technologies or solutions?

Yes, we want to build partnerships that can offer companies the entire sintering process from a single source. As of the end of August will be announcing to the public for the first time.

What is your outlook for the remainder of 2023?

We are extremely confident that 2023 and the years to come will be very successful. We have made the right preparations to offer our customers technologies and processes with which they can meet the current and future challenges.

Finally, is there anything else you would like to share about Tresky with our readers?

If you are interested in sintering with copper and silver pastes or DTF, feel free to contact us!

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Written by Daniel Schultze

Daniel is CEO of Tresky Automation, a company offering system solutions covering the entire spectrum of DIE bonding. The machines Daniel offers to global clients can be tailored to individual manufacturing requirements and provide high degrees of precision and flexibility.