GET IN TOUCH
    Our Company

    ESCATEC have a long history of providing design and manufacturing solutions to world-renowned OEMs. We realise their ideas, from concept to delivery to after-sales service, and offer them the specific solutions they need.

    Who we are
    Market Segments

    ESCATEC partners with numerous major OEM brands across a wide range of market segments. We have helped OEMs in a variety of sectors such as; Industrial Electronics; Medical, Healthcare & Life-sciences; Mobility & Transportation; IoT & Connected Devices.

    Who we serve
    Global Facilities

    ESCATEC has a global footprint with production facilities in the UK, the Czech Republic, Switzerland, Bulgaria, and Malaysia. We have the capacity, expertise, and sector experience to better serve customers across a broader range of industries.

    Where we are
    Innovate

    You are an inventor. You have the idea, the concept, the vision of what you want to create. So, together, we Innovate. Through our design and development and NPI processes, we take your idea and make it a reality by turning it into a marketing leading product.

    View the Innovate page

    Jump to:

    Scale

    Whatever product or market, ESCATEC is a truly global company with sites across Europe and Asia that use the latest technology. We seamlessly transition from prototyping to volume manufacturing so you can Scale and meet the needs of your market.

    View the Scale page

    Jump to:

    Repeat

    Demand for your product is strong but you know it’s only a matter of time before the competition start to try and catch up. You’re not looking to standstill, you’re a market leader, and that’s where the ‘Repeat’ stage of the ESCATEC process kicks in.

    View the Repeat page

    Jump to:

    SOLUTION

    Microelectronics

    Our experienced micro-assembly team have designed, developed, and manufactured a wide range of innovative devices including security camera modules, Time of Flight sensors, LiDAR systems, tire pressure sensors, micro scanners, NIR spectrometers, high-performance LED, laser, and lighting solutions. With state-of-the-art cleanroom facilities and technology, we ensure your micro-optic needs for highly complex products are met and delivered. 

    Two hands wearing white gloves holding up two round flexi-rigid green and brown PCBAs in front of a piece of test equipment.
    The inside of electronic semiconductor chip under high magnification showing exposed bare wires and the silicon die in green and blue lighting.
    Two electronics manufacturing operatives wearing blue overalls in a clean room environment. One operator is inspecting an electronic microchip under a high power microscope.
    The inside of semiconductor chip under high magnification showing exposed bare wires and the silicon die.
    A close-up image of inside a gold wire bonder machine showing the capillary of a bond wire head.
    Fingers wearing white gloves holding three small green round PCBAs.
    Two electronics manufacturing operatives wearing blue overalls in a clean room environment. One is standing up holding a tray of chip wavers and one is sitting in front of a Tresky T-6000 Die Bonder machine.
    A single hand with white gloves holding a PCBA under a 3D Optical Microscope.
    A close-up image of inside a wire bonder machine with a red light shining showing the capillary of a bond wire head.

    Many factors must be considered when designing an optimised and fully functioning Micro-Opto-Electronic-Mechanical-System (MOEMS) device. One of the most important factors for robust functionality is a stable production process. Our demonstrable experience spanning decades allows us to offer customers a range of development services around MOEMS technologies resulting in more compact, efficient, higher performing and cost-effective devices.

    Our Chip On Board (COB) process steps consist of die bonding, wire bonding and several encapsulation techniques including glob top, dam (or underfill) and optical clear encapsulation.

    microelectronics-escatec-1

    The range of die bonding machines we have can work to +/- 1um, stamping or dispensing adhesives, and picking and placing bare chips from blue tape, waffle packs or gel packs. 

    Our wire bonding machines are suitable for all wirebond technologies including gold ball and thin wire. Quick and simple bond head changeover times of under 30 minutes can be achieved along with continuing monitoring and control of the bond process.

    Advantages of Choosing Our Microelectronics Assembly Services

    By partnering with ESCATEC, you gain access to numerous advantages:

    • Faster Time-to-Market: Our efficient processes reduce lead times, getting your products to market sooner.
    • Cost-Effective Solutions: We offer competitive pricing without compromising on quality.
    • Scalability: From prototypes to high-volume production, we are able to scale to meet your future needs.
    • Quality Control: Our commitment to quality ensures your products are defect-free.
    • Customer-Centric Approach: Collaboration and communication are at the heart of our client relationships.

     

    Technology and Innovation

    Our Technology Council ensure we stay ahead of the curve through continuous research and development. Our commitment to innovation enables us to leverage the latest technologies and methodologies to enhance our microelectronics assembly services.

    microelectronics-escatec-2


    Global Presence

    With a global presence and strategically located facilities, we can serve clients around the world. No matter where you are, ESCATEC is ready to meet your microelectronics assembly needs.

    microelectronics-escatec

    Client Industries

    We proudly serve a diverse range of industries, including:
    Escatec-Consumer-Electronics

    Consumer Electronics

    Escatec-Medical-Devices

    Medical Devices

    Escatec-Automotive

    Automotive

    Escatec-Industrial-Equipment

    Industrial Equipment

    Expertise exceeding expectations

    ESCATEC's manufacturing capabilities are complemented by enhanced support services for our clients, such as design and development support, test solutions, sophisticated supply chain management, postponement manufacturing and direct-ship outbound logistics.

    pcba-slider

    PCB Assembly

    We support customers from the prototype and industrialisation stages, through to the ongoing manufacture of complex, multi-technology PCBAs, in low, medium and high volumes.

    Read more
    box-build-slider

    Box Build Assembly

    We're experts in complex sub-assemblies and finished, tested, products. We offer turnkey electronics, mechatronics, cabinet assembly, system integration & test solutions.

    Discover more
    cabinet-build-slider

    Control Cabinet Build

    ESCATEC delivers a broad range of options for customers requiring rack system development, from single front panel assembly to a full custom control cabinet.

    Find out more
    cable-assembly-slider

    Cables and Looms

    ESCATEC offers straightforward looms through to multi-component assemblies and complex wiring harnesses to support box build and mechatronics demand.

    Learn More
    mechatronics-slider

    Mechatronics

    ESCATEC offers a wide range of mechatronics solutions and supply chain experience - everything from ‘benchtop’ products through to ‘large format’ electro-mechanical machines. 

    Discover more
    Picture

    Test Solutions

    A proven method of electronics manufacturing defect detection and prevention, flying probe testing also eliminates the requirement for dedicated fixturing.

    Discover more
    injection-moulding-slider

    Plastic Injection Moulding

    At ESCATEC we use cutting-edge technology and equipment, to ensure that every injection moulding project we undertake meets the highest standards of quality and precision. 

    Discover more
    microelectronics-slider-2

    Microelectronics

    Our experienced teams design, develop and manufacture high performance LED, laser, and lighting solutions. We ensure micro-optic needs for complex MOEMS products are met and delivered.

    Discover more

    Get in Touch

    Ready to experience our world-class microelectronics assembly services?
    Contact us today to discuss your project's requirements, request a quote, or learn more about how we can contribute to your success.

    CONTACT US

    Join our subscribers

    News, articles, industry insights and more straight to your inbox.