Our experienced micro-assembly team have designed, developed, and manufactured a wide range of innovative devices including security camera modules, Time of Flight sensors, LiDAR systems, tire pressure sensors, micro scanners, NIR spectrometers, high-performance LED, laser, and lighting solutions. With state-of-the-art cleanroom facilities and technology, we ensure your micro-optic needs for highly complex products are met and delivered. 

Two hands wearing white gloves holding up two round flexi-rigid green and brown PCBAs in front of a piece of test equipment.
The inside of electronic semiconductor chip under high magnification showing exposed bare wires and the silicon die in green and blue lighting.
Two electronics manufacturing operatives wearing blue overalls in a clean room environment. One operator is inspecting an electronic microchip under a high power microscope.
The inside of semiconductor chip under high magnification showing exposed bare wires and the silicon die.
A close-up image of inside a gold wire bonder machine showing the capillary of a bond wire head.
Fingers wearing white gloves holding three small green round PCBAs.
Two electronics manufacturing operatives wearing blue overalls in a clean room environment. One is standing up holding a tray of chip wavers and one is sitting in front of a Tresky T-6000 Die Bonder machine.
A single hand with white gloves holding a PCBA under a 3D Optical Microscope.
A close-up image of inside a wire bonder machine with a red light shining showing the capillary of a bond wire head.

Many factors must be considered when designing an optimised and fully functioning Micro-Opto-Electronic-Mechanical-System (MOEMS) device. One of the most important factors for robust functionality is a stable production process. Our demonstrable experience spanning decades allows us to offer customers a range of development services around MOEMS technologies resulting in more compact, efficient, higher performing and cost-effective devices.

Our Chip On Board (COB) process steps consist of die bonding, wire bonding and several encapsulation techniques including glob top, dam (or underfill) and optical clear encapsulation.


The range of die bonding machines we have can work to +/- 1um, stamping or dispensing adhesives, and picking and placing bare chips from blue tape, waffle packs or gel packs. 

Our wire bonding machines are suitable for all wirebond technologies including gold ball and thin wire. Quick and simple bond head changeover times of under 30 minutes can be achieved along with continuing monitoring and control of the bond process.

Advantages of Choosing Our Microelectronics Assembly Services

By partnering with ESCATEC, you gain access to numerous advantages:

  • Faster Time-to-Market: Our efficient processes reduce lead times, getting your products to market sooner.
  • Cost-Effective Solutions: We offer competitive pricing without compromising on quality.
  • Scalability: From prototypes to high-volume production, we are able to scale to meet your future needs.
  • Quality Control: Our commitment to quality ensures your products are defect-free.
  • Customer-Centric Approach: Collaboration and communication are at the heart of our client relationships.


Technology and Innovation

Our Technology Council ensure we stay ahead of the curve through continuous research and development. Our commitment to innovation enables us to leverage the latest technologies and methodologies to enhance our microelectronics assembly services.


Global Presence

With a global presence and strategically located facilities, we can serve clients around the world. No matter where you are, ESCATEC is ready to meet your microelectronics assembly needs.


Client Industries

We proudly serve a diverse range of industries, including:

Consumer Electronics


Medical Devices




Industrial Equipment

Expertise exceeding expectations

ESCATEC's manufacturing capabilities are complemented by enhanced support services for our clients, such as design and development support, test solutions, sophisticated supply chain management, postponement manufacturing and direct-ship outbound logistics.


PCB Assembly

We support customers from the prototype and industrialisation stages, through to the ongoing manufacture of complex, multi-technology PCBAs, in low, medium and high volumes.


Box Build Assembly

We're experts in complex sub-assemblies and finished, tested, products. We offer turnkey electronics, mechatronics, cabinet assembly, system integration & test solutions.


Control Cabinet Build

ESCATEC delivers a broad range of options for customers requiring rack system development, from single front panel assembly to a full custom control cabinet.


Cables and Looms

ESCATEC offers straightforward looms through to multi-component assemblies and complex wiring harnesses to support box build and mechatronics demand.



ESCATEC offers a wide range of mechatronics solutions and supply chain experience - everything from ‘benchtop’ products through to ‘large format’ electro-mechanical machines. 


Test Solutions

A proven method of electronics manufacturing defect detection and prevention, flying probe testing also eliminates the requirement for dedicated fixturing.


Plastic Injection Moulding

At ESCATEC we use cutting-edge technology and equipment, to ensure that every injection moulding project we undertake meets the highest standards of quality and precision. 



Our experienced teams design, develop and manufacture high performance LED, laser, and lighting solutions. We ensure micro-optic needs for complex MOEMS products are met and delivered.

Get in Touch

Ready to experience our world-class microelectronics assembly services?
Contact us today to discuss your project's requirements, request a quote, or learn more about how we can contribute to your success.

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