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ESCATEC at a glance
Everything you need to know about our company in one handy guide.
Everything you need to know about our company in one handy guide.
ESCATEC provides microelectronics assembly for OEMs that need precise, cleanroom-controlled manufacturing for compact, high-performance devices, including Micro-Opto-Electronic-Mechanical-System (MOEMS)- related applications.
Our microelectronic services ensure faster time-to-market, cost-effective manufacture, scalability from prototype to high-volume production, and rigorous quality assurance and testing.
ESCATEC provides a focused set of microelectronics manufacturing services for OEMs that need more than standard PCBA. Our precision micro-assembly services span SMT, chip-on-board, wire bonding, die attach, active alignment, cleanroom-controlled production, and quality assurance/testing.
Our comprehensive suite of microelectronics assembly services includes:
ESCATEC offers Micro-Opto-Electronic-Mechanical-System (MOEMS) development and manufacturing, with COB process steps including die bonding, wire bonding, and encapsulation methods including glob top, dam/underfill, and optical clear encapsulation.
Our die bonding equipment works to +/- 1um and bare chips can be picked and placed from blue tape, waffle packs, or gel packs. Additionally, our wire bonding machines are suitable for all wire bonding technologies, including gold ball and thin wire, with continuous monitoring and control of the bonding process.
Engineering support to improve manufacturability, testability, and production readiness.
Structured NPI to move products from development into controlled production.
Prototyping, PCBA, microelectronics, box build assembly, mechatronics, machining, and injection moulding.
Test approaches to support verification and quality control during manufacturing.
Procurement and supply chain coordination for build continuity.
Servicing, repair, lifecycle management, and logistics.
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SI Sensors needed to move a complex ultra-high-speed image sensor from prototype assembly into repeatable production. ESCATEC combined microelectronics expertise, bespoke tooling, and micron-level assembly processes to manage thermal and structural demands. The result was a scalable production route built around reliability, precision, and long-term sensor performance.
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