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ESCATEC at a glance
Everything you need to know about our company in one handy guide.
Everything you need to know about our company in one handy guide.
Testing is an integral part of the manufacturing process, ensuring that defects are identified and resolved before a product reaches a customer. It is the only way to achieve optimal processes that result in products with as close to a zero percent failure rate as possible.
Our test solutions and expertise are especially relevant for companies that need fixtureless options for high-mix builds, on-site ICT for repeatable volume manufacture, or custom functional test and diagnostics integrated into the manufacturing process.
ESCATEC provides four core test solution types: flying-probe testing, in-circuit testing, boundary-scan testing, and functional testing. Together, these methods help identify faults earlier in the product lifecycle, reduce debug effort, and increase confidence that boards and assemblies meet their intended specifications before delivery.
Flying probe testing is a strong option when batch sizes are small, board mix is high, or fixed-probe access is limited or impractical. Because it uses precision-movable probes to access test points, vias, pads, interconnections, and fine-pitch parts directly, it eliminates the need for dedicated fixturing while still achieving coverage similar to ICT.
ESCATEC offers on-site ICT covering analogue and digital tests, including vectorless tests. ICT fixtures and programmes are also produced on-site, meaning we own both the hardware and the test implementation for our customers.
Boundary scan is a rapid, non-intrusive test method for complex digital circuits. ESCATEC specifically leverages X-JTAG technology, paired with board-edge access, robust diagnostics, and the ability to identify structural faults beneath BGAs without mechanical access to the circuit.
Functional testing is where ESCATEC moves from structural verification into proving that PCBs perform as intended in their real application environment. We can develop in-house functional test solutions or work with those supplied by our customers, and our extensive engineering diagnostics support compliance with customer-provided specifications.
The right test method depends on your product’s complexity, the level of access to the circuit, expected volume, and the diagnostic depth you need.
Flying-probe testing is a good choice for fixtureless flexibility and lower-volume/high-mix work; ICT is best for repeatable, higher-volume PCBAs; boundary-scan testing supports complex digital boards with limited physical access; and functional testing helps prove performance in the intended use case.
Whether you need a fixtureless flying probe, dedicated ICT fixtures and programmes, or a specific functional test setup, ESCATEC can support the test approach aligned to your product, volumes, and diagnostic requirements.
A Silicon Valley pharmaceutical company needed a device that met usability, sustainability, and manufacturing-readiness requirements while supporting FDA and ISO 13485 requirements. ESCATEC applied DfX, system integration, and precision control expertise to simplify the design and improve the user experience. The final design supported a smoother ramp-up toward an initial production phase.
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Engineering support to improve manufacturability, testability, and production readiness.
Structured NPI to move products from development into controlled production.
Prototyping, PCBA, microelectronics, box build assembly, mechatronics, machining, and injection moulding.
Test approaches to support verification and quality control during manufacturing.
Procurement and supply chain coordination for build continuity.
Servicing, repair, lifecycle management, and logistics.
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Why testing should be at the heart of everything you do
