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SI Sensors’ ultra-high-speed image sensor can capture millions of images per second at full resolution for their Kirana high-speed video camera. However, such speed dissipates high power on chip and generates considerable heat, necessitating advanced thermal management. To solve this, they developed a custom Aluminium Nitride ceramic package for the sensor, which is mounted with micron-level accuracy.
This approach, while innovative, increased manufacturing complexity when transitioning the product from a prototype to scalable production. SI Sensors needed a partner with deep technical know-how, robust manufacturing capabilities, and a relentless focus on quality and precision to make the transition successful.
Assembly of the Kirana image sensors in the novel Aluminium Nitride ceramic package
ESCATEC partnered with SI Sensors to engineer a solution that not only addressed the thermal and assembly challenges but also enabled high-yield, repeatable, dependable production.
Over a two-year collaboration, ESCATEC worked closely with SI Sensors to co-develop bespoke jigs, tools, and precision processes tailored specifically for the sensor’s unique requirements. The partnership focused on creating a scalable and reliable assembly workflow that maintained the sensor’s structural and thermal integrity under demanding operational conditions.
“We worked closely with ESCATEC over the last 2 years to enable a transition from engineering prototype assembly to high yield production sensors, which are currently undergoing full characterisation.”
Philip Brown, General Manager of SI Sensors
To ensure the highest quality standards, a 100% X-ray inspection process was also implemented for each and every sensor to validate adhesive bonding and wire connections. This ensures flawless performance and eliminates the risk of microscopic defects that could compromise functionality.
X-ray inspection of image sensor bonding and wire bonds
Thanks to this highly collaborative partnership, underpinned by ESCATEC’s engineering expertise and commitment to quality, SI Sensors successfully transitioned the Kirana image sensor from prototype to production, increasing manufacturing yield while ensuring long-term reliability and performance of the sensors in real-world applications.
By overcoming the twin challenges of thermal management and precision assembly, ESCATEC empowered SI Sensors to bring a game-changing product to market, providing end users with a breakthrough tool in scientific imaging and diagnostics.
The collaboration between SI Sensors and ESCATEC exemplifies what’s possible when deep engineering expertise meets advanced manufacturing excellence. With scalable production now underway, this partnership is advancing high-speed imaging whilst redefining what OEMs can expect from a true manufacturing partner.
