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Specialist PCB Assembly Services

ESCATEC offers specialist PCB assembly services that take electronic products from prototype builds through to reliable, scalable volume production.

PCB Assembly with ESCATEC

ESCATEC’s Printed Circuit Board Assembly (PCBA) offering helps OEMs transform a validated design into a stable, repeatable manufacturing process while maintaining quality, cost control and production flexibility.

Production ranges from prototype builds through to the manufacture of complex, multi-technology PCBAs in low, medium and high volumes — from a few hundred to millions of units per year.

Assemblies are produced across substrates, including FR4, flex, rigid-flex and metal-backed laminates, using RoHS-compliant or leaded processes to IPC-A-610 Class 2 or 3 standards.

Key facts at a glance

Multi-technology PCB assembly including Surface Mount Technology (SMT) and Through-Hole Technology (THT).
Advanced component capability including BGA, fine-pitch components, Chip-on-Board (CoB) and Package-on-Package (PoP).
PCB substrate support including FR4, flex circuits, rigid-flex PCBs and metal-backed laminates.
Manufacturing to IPC-A-610 Class 2 or Class 3 standards.
Inspection and testing capabilities, including AOI, X-ray inspection, ICT, flying probe and functional testing.
Production volumes range from prototype quantities to millions of units annually.
Global manufacturing across Europe and Asia.

How does ESCATEC’s PCB Assembly process work?

ESCATEC’s PCBA service takes customers from the initial PCB design stage through to full-scale production. Our engineering and production teams work closely with customers to ensure new electronic products are introduced successfully, on time and within budget.

A typical ESCATEC product realisation project includes:

Design support to review manufacturability and optimise the PCB design for production
Verification and validation of the design and manufacturing process
Value Engineering and Value Analysis to improve cost efficiency without reducing quality
PCB prototype builds to validate the design and production approach
Pilot builds as part of New Product Introduction (NPI) to refine the production process
Transition to stable volume manufacturing

This structured approach allows ESCATEC to reduce manufacturing risk while preparing products for reliable long-term production.

ESCATEC’s PCB Assembly technologies and capabilities

ESCATEC supports a wide range of PCB assembly technologies designed to accommodate modern electronics designs and complex component layouts.

Core assembly capabilities include:

Surface Mount Technology (SMT)
Through-Hole Technology (THT)
Chip-On-Board (CoB)
Ball Grid Array (BGA) placement
Package-on-Package (PoP) assembly
Fine pitch component placement

Our IPC-A-610-trained operators and technicians have an array of tools and equipment at their disposal, enabling them to perform all the operations required by our customers and to monitor and manage processes for zero defects.

Our increasing portfolio of PCB assembly equipment and capabilities includes:

PCB laser marking

Solder paste printers (screen and jet)

3D solder paste inspection

Pick and place machine

Reflow ovens

3D AOI machines

X-ray inspection for BGA/QFN

Hand, Wave and Selective soldering

PCB laser depaneling

Underfilling

Conformal coating

Hydrophobic coating

Low pressure molding

Over molding

Enclosure laser marking

CASE STUDY

Managing high-mix PCB assembly under one roof

CASE STUDY

Managing high-mix PCB assembly under one roof

A global smart lighting leader needed to manage nearly 100 active variants across multiple product families with fluctuating demand. ESCATEC combined PCBA, box build, and plastic injection moulding into an integrated manufacturing model. This reduced supplier complexity, improved coordination, and supported consistent delivery across a broad, high-mix product portfolio.

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Managing high-mix PCB assembly under one roof

PCB test and inspection

ESCATEC designs and implements PCB test and inspection strategies that verify product quality, functionality and manufacturing process integrity. Effective testing helps identify defects early, reducing field failures and improving long-term product reliability.

Testing strategies are defined based on factors including:

Product design requirements
Testability requirements
Component types
Product complexity
Manufacturing process
Product maturity
Product lifecycle expectations

Based on this assessment, ESCATEC selects the most appropriate inspection and testing methods for each product.

Our advanced PCB and PCBA inspection and testing solutions include:

Manufacturing Defect Analysis (MDA)
In-Circuit Test (ICT)
Flying Probe Testing
Boundary Scan
Functional Test
3D AOI / SPI at PCBA level
High Pot Testing
Burn-In Testing

Microelectronics and Chip-on-Board assembly

ESCATEC provides specialised Chip-on-Board (CoB) and microelectronics assembly services for applications requiring high levels of integration and miniaturisation. These capabilities are supported by ISO Class 7 cleanroom environments and dedicated microelectronics manufacturing processes.

Chip-on-Board assembly involves mounting semiconductor dies directly onto a PCB substrate, followed by electrical connection and encapsulation to protect the device from mechanical damage and environmental influences.

Design and development capabilities

ESCATEC supports the development of microelectronic systems through capabilities including:

Conceptual design
PCB assembly process development
Fast prototyping
Thermal simulation
Optical analysis
LED front- and back-end design

Microelectronics manufacturing capabilities

Microelectronics manufacturing processes include:

Die bonding
Wire bonding
Encapsulation and jet dispensing
Active optical alignment

ESCATEC’s die bonding systems can achieve placement accuracy of ±1 µm and support multiple packaging formats, including blue tape, waffle packs and gel packs. Wire bonding equipment supports gold ball bonding and fine wire bonding from 17–50 µm.

For optoelectronic applications, ESCATEC also supports designs using bare LED dies rather than packaged LEDs, enabling more customised optical and thermal performance.

Micro-assembly and optoelectronic systems

ESCATEC’s micro-assembly capabilities support complex Micro-Opto-Electro-Mechanical Systems (MOEMS) and miniature electronic assemblies produced under cleanroom conditions.

These capabilities include:

Integration of precision optics with micro-PCB assemblies
Active and passive optical alignment
Burn-in fixtures and custom test equipment
Optical measurement and system testing

For regulated applications such as medical devices, ESCATEC’s design and manufacturing processes operate under ISO 13485 certification.

Why partner with ESCATEC for PCB Assembly services?

ESCATEC operates a global manufacturing network designed to provide flexible production capacity and supply chain resilience.

Production facilities are located in:

Malaysia
Switzerland
United Kingdom
Czech Republic
Bulgaria

ESCATEC also has a long-term partnership agreement in the United States.

Our global footprint allows customers to balance cost efficiency, logistics and proximity to key markets when planning their manufacturing strategy.

ESCATEC continues to invest in its people, processes, systems and manufacturing technologies. Our Technology Council ensures PCB assembly equipment and capabilities evolve alongside changing technical and quality requirements, enabling customers to innovate and scale.

When to consider ESCATEC’s PCBA solutions

ESCATEC’s PCBA solutions are particularly suited to organisations that require:

A manufacturing partner capable of supporting prototype builds through to high-volume production
Multi-technology PCB assembly for complex electronic products
Advanced inspection and testing coverage to support product reliability
Global manufacturing options to support supply chain resilience and scaling
Engineering collaboration to optimise manufacturability during product ramp-up

Discuss your PCB assembly requirements

What industries and product types does ESCATEC support?

ESCATEC provides PCB assembly services for OEMs in the Industrial, Medical and Transportation sectors, supporting a wide range of electronics and mechatronic products, including:

Printed circuit board assemblies (PCBAs)
Microelectronic assemblies
Sub-assemblies and electronic modules
Complete electronic systems

These services are supported by ESCATEC’s broader manufacturing capabilities, which include:

Box build assembly
Precision machining
Injection moulding
Microelectronics assembly
Post-production services

OUR DESIGN, DEVELOPMENT, AND MANUFACTURING SERVICES

We offer comprehensive EMS services for OEMs looking to scale their business by outsourcing design & manufacturing.

Design, Development & DfX

Engineering support to improve manufacturability, testability, and  production readiness.

New Product Introduction

Structured NPI to move products from development into controlled production.

Manufacturing Capabilities

Prototyping, PCBA, microelectronics, box build assembly, mechatronics, machining, and injection moulding.

Test Solutions and QA

Test approaches to support verification and quality control during manufacturing.

Supply Chain Management

Procurement and supply chain coordination for build continuity.

Value-Added Post-Production Services

Servicing, repair, lifecycle management,  and logistics.

Hover over infographic to find out more

Design & Development

New Product Introduction

Supply Chain Management

Plastic Injection Moulding

Test Solutions

Post Production

PCB Assembly timelines

Project timelines depend on factors such as design maturity, component availability, testing requirements and production volumes.

To accelerate the process, ESCATEC works with customers to align early on:

Complete design documentation (Gerbers, BOM, schematics and drawings)
Defined prototype and pilot build strategy
Testing requirements and coverage expectations
Supply chain considerations, including component availability and alternates

By addressing these factors early, ESCATEC helps customers move smoothly from prototype builds into stable volume production.

READY TO START A PCB ASSEMBLY PROJECT WITH ESCATEC?

If you are preparing a new electronic product for manufacturing, ESCATEC can review your design and production requirements to help define the most suitable PCB assembly strategy.

Using your PCB design data, BOM and production requirements, our engineers assess manufacturability, testing strategy and supply chain considerations to determine the most efficient path to stable volume production.

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PCB Assembly FAQs

What is PCB Assembly?

PCB assembly is the process of mounting and soldering electronic components onto a printed circuit board to create a functioning electronic circuit.

What production volumes can ESCATEC support?

ESCATEC supports production volumes ranging from small prototype builds through to millions of units per year, allowing products to scale as demand grows.

What types of PCBs can ESCATEC assemble?

ESCATEC supports a variety of PCB types including FR4, flex circuits, rigid-flex PCBs and metal-backed laminates.

What testing methods are available?

Testing methods include AOI, X-ray inspection, in-circuit testing (ICT), flying probe testing, boundary scan and functional testing, depending on product requirements.

Does ESCATEC support advanced microelectronics assembly?

Yes. ESCATEC offers Chip-on-Board (CoB) and microelectronics assembly, including die bonding and wire bonding processes performed in cleanroom environments.

FREE GUIDE

An introduction to outsourcing your electronics manufacturing

This guide provides practical guidance and best practice advice on how to efficiently outsource your manufacturing.

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ESCATEC's manufacturing capabilities are complemented by enhanced support services for our clients, such as design and development support, test solutions, sophisticated supply chain management, postponement manufacturing and direct-ship outbound logistics.

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