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Our design, development & manufacturing capabilities
Design & Development
New Product Introduction
Supply Chain Management
Prototyping
Microelectronics
PCB Assembly
Box Build Assembly
Mechatronics
Machining
Plastic Injection Moulding
Test Solutions
Post Production
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Services
Design & Development
NPI
Supply Chain Management
Microelectronics
Prototyping
PCB Assembly
Box Build Assembly
Mechatronics
Machining
Injection Moulding
Test Solutions
Post Production
Markets
Industrial
Medical
Transportation
Locations
Malaysia (Penang)
Malaysia (Johor Bahru)
Switzerland
United Kingdom
Czech Republic
Bulgaria
About
ESG
Resources
News
Blogs
Case Studies
Guides
Careers
Why choose ESCATEC
Current Vacancies
Talk to Sales
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DESIGN & DEVELOPMENT
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Process
Design
SYSTEMS
DESIGN
Electronics Hardware
Embedded Software
Mechanical Design
Embedded Software
Software architecture
Embedded SW (C, C++)
Application SW (Linux, Java, Python)
Implementation of MMI & GUI
Board support packages (BSP)
Built in systems test (BIST)
Continuous improvement (updates)
Mechanical Design
3D mechanical design (solid edge)
Material evaluation & selection
DFM/DFA, FEM simulations
Environmental testing
Fast prototyping (in-house 3D printing)
Collaboration with industrial designers
Management of toolmakers
Electronics Hardware
Schematics design
Key component evaluation
Miniaturisation & packaging
COB, LIDAR, TOF processing
PCB technology evaluation
PCB & layout design
Fast prototyping (in-house PCB assy)
Systems Design
Requirements Engineering
Feasibility Study
System Architecture
Partner Evaluation
System Integration
Product Specification
System Verification
Design Transfer