SOLUTION

SCALE

At ESCATEC, we help our customers Innovate, Scale, and Repeat. We make the transition between design and manufacturing seamless. And we work with you to extend the lifetime of products out in the marketplace whilst supporting you with the next iteration. It’s a continuous cycle of improvement.

Whatever product or market, ESCATEC is a truly global company with sites across Europe and Asia that use the latest technology. Regardless of end user demand, we seamlessly transition from prototyping to volume manufacturing so you can Scale and meet the needs of your market.


Intelligent Supply Chain

Intelligent Supply Chain Management 

When selecting an electronics manufacturing services (EMS) partner, OEMs should seek one with demonstrable electronics supply chain management (SCM) capabilities. As we all learnt the hard way, this is paramount in a post-Covid world.

ESCATEC understands the critical importance of the robustness that diversification brings; therefore, we have experienced procurement, SCM and logistics personnel in Malaysia, Switzerland, the UK, the Czech Republic and Bulgaria.

Global Sourcing

Our procurement, supply chain and logistics teams have the expertise to identify sourcing options based on the specific needs of each product and customer. 

We supply a varied range of products to a broad group of sectors; this requires us to procure a wide range of different component types – from machined, cast and formed metal products to high-end electronic components, plastics, motors, power supplies and many other commodity types – all contributing to an extensive portfolio of procured parts. 

Our goal is to build long-term, collaborative relationships with our approved global supplier partners. This enables us to continually reduce the total cost of acquisition and supply chain complexity whilst still maintaining the highest levels of quality and delivery.

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Managing Obsolescence

With product life cycles becoming shorter each year, especially within the semiconductor market, thousands of components become obsolete. At ESCATEC, we have significant expertise in all aspects of obsolescence management and work closely with key partners to provide customers with up-to-date device information. With early warning processes in place to identify ‘at-risk’ parts, we can perform obsolescence risk analysis across your product range before a part has been discontinued. 

Our expertise in ensuring that customers’ Bills of Materials (BOMs) are accurate and complete is supported by sophisticated audit and analysis tools that provide customers with the confidence that they will be kept fully aware of component life cycle information. Our knowledge and close monitoring of markets ensure that we are able to adapt our supply chain to changes in market conditions with speed and agility.

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Counterfeit Avoidance

ESCATEC has significant expertise in this area, which helps prevent counterfeit devices from making it through to customers’ products.

In addition to stringent supplier selection and monitoring, we have made a substantial investment in people, equipment and processes to help identify suspect devices. Within the group, we have a dedicated component test laboratory providing ‘best in class’ incoming inspection, including X-ray, microscopes, electrical comparators and chemical marking permanency analysis.

Our counterfeit avoidance processes are based on the emerging Industry Standard guidelines, including IDEA-STD-1010-B, SAE AS5553 and SAE AS6081.

Supply Chain Excellence

ESCATEC strives to have a positive impact on the environment, customers, employees and the community by recognising the importance of a responsible and sustainable lean supply chain. This is supported by robust policies in all aspects of our corporate social responsibility.

At ESCATEC, we aim to exceed your expectations in every aspect of our relationship. Supply chain and materials management is clearly a critical element of this. Our efficient sourcing, SCM and logistics not only reduce risk from global supply chains but deliver significant ongoing benefits to our customers.

Operator_supply chain excellence

WORKSHOP

Power up your ideas, designs and products.

Our experts analyse your idea, design or product and provide you with detailed suggestions for improvement.

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Electronics Manufacturing & Moulding

Micro-Opto-Electronic-Mechanical-Systems (MOEMS) Assembly

Our experienced micro-assembly teams design, develop and manufacture high performance LED, laser, and lighting solutions. With state-of-the-art cleanroom facilities and technology, we ensure your micro-optic needs for highly complex MOEMS products are met and delivered. 

Many factors must be considered when designing an optimised and fully functioning Micro-Opto-Electronic-Mechanical-System device. One of the most important factors for robust functionality is a stable production process. Our demonstrable experience spanning decades allows us to offer customers a range of development services around MOEMS technologies resulting in more compact, efficient, higher performing and cost-effective devices.

Our Chip On Board (COB) process steps consist of die bonding, wire bonding and several encapsulation techniques including glob top, dam (or underfill) and optical clear encapsulation.

The range of die bonding machines we have can work to +/- 1um, stamping or dispensing adhesives, and picking and placing bare chips from blue tape, waffle packs or gel packs. 

Our wire bonding machines are suitable for all wirebond technologies including gold ball and thin wire. Quick and simple bond head changeover times of under 30 minutes can be achieved along with continuing monitoring and control of the bond process.

MOEMS

Printed Circuit Board Assembly

ESCATEC offers an extensive range of PCB assembly services, which complement our expertise in electrical, mechanical, and electro-mechanical contract assembly. 

Our assembly services range from the initial production of prototypes to the ongoing manufacture of complex, multi-technology PCBAs, in quantities ranging from a few hundred to millions of units per year. All common (and less common) PCB substrate materials are populated, including FR4, flexi, flexi-rigid and metal backed laminates.

We are competent in Ball Grid Array (BGA), Package on Package (PoP) and Chip On Board (COB) processes utilising state-of-the-art surface mount placement machines and we can also form, populate and solder through-hole components, either by hand or by using automatic soldering techniques.  Our PCBA services encompass both through-hole (conventional), and our automated state-of-the-art surface mount (SMT) machines assemble and inspect your boards. Our experienced operators monitor and manage processes to ensure there are zero defects. 

PCB test and inspection

ESCATEC is experienced in designing and implementing a variety of test techniques to ensure products are reliable and thoroughly tested – saving customers' time and money downstream by reducing field failures. We develop sound-test and inspection strategies that verify defined product quality and functionality, in addition to manufacturing process integrity.

Our in-depth technical assessment is based on the following considerations:

  • Product design requirements
  • Testability requirements
  • Component types
  • Product complexity
  • Manufacturing process
  • Product maturity
  • Product lifecycle implications

We can predict the defects most likely to occur in the manufacturing process by assessing the above factors in detail. Our customers have boosted both the cost-effectiveness and reliability of their end products by taking this assessment into account. 

PCB Assembly

Box Build Assembly

Complementing our PCB assembly services, ESCATEC’s box build capability forms part of a comprehensive array of electro-mechanical assembly, cabinet assembly and complete system integration services.

Our customers take advantage of tailored, flexible, configure-to-order, system integration and test services. Whether you need a small PCB assembling into a plastic enclosure or a large front panel equipped with a display, full harness, connectors, switches, fuses, etc we can help.

Going beyond the remit of a typical box build, ESCATEC’s engineering and manufacturing teams are also experienced in the production of complex electro-mechanical "mechatronics" products. These are better described as machines rather than products and often require bespoke configuration.

Our box build manufacturing expertise encompasses:

  • Cables
  • Harnesses
  • Complex looms
  • Backplanes
  • Sub-modules
  • Complex electro-mechanical assembly
  • Electro-pneumatic assembly
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Control Cabinet Assembly
& Panel Wiring

ESCATEC offers extensive experience in the provision and integration of wiring looms, 19" rack systems and control cabinets. From single or multiple panel rack systems to full custom control cabinet suites, we can deliver to precise customer specifications in low to medium volumes.

Our team uses our customers' technical drawings and specifications to develop fully integrated rackmount solutions. A high level of accuracy means we capture every detail of your control cabinet configuration and hardware, so our service is ideal for multiple identical cabinet installations.

We can also customise control cabinet enclosures with safety glass, mesh and steel ventilated doors. Customers can also select customised cable access and power management.

Control Cabinet V2

ESCATEC delivers a broad range of options for customers requiring rack system development, from single front panel assembly to a full custom control cabinet. Renowned as a quality, "right-first-time" service, our rack systems expertise means we can procure all necessary components.

Whether you need controllers, switches, timers, encoders, machined and fabricated metalwork or even plastic products, we will co-ordinate your supply chain and deliver guaranteed traceability.

From transportation through to industrial, telecoms, railways, and renewable energy, we support diverse manufacturers with a range of integration capabilities, including:

  • Custom cabling
  • Panel wiring
  • Modular sub-rack manufacture
  • Sub-rack installation (backplanes, daughter cards)
  • Power installation
  • Power configuration
  • Heat management
  • Systems integration
  • Telecommunications cabinets
  • Process control and automation
  • Software loading
  • Software testing

Cable Assembly and Wiring Looms

ESCATEC has a breadth of experience gained from producing simple point-to-point cables and straightforward looms to multi-component assemblies and complex looms. We can process cable from 36AWG to 6AWG for use in demanding environments, including medical, surgical, or high-end audio.

Whether your requirement is for a single-ended wire or a full harness complete with connectors, switches, and fuses, you can be confident that we will provide a high-quality service that is right the first time.

Cables

Electro-mechanical assembly

We produce many complex mechanical assemblies, which often feature a similar number of parts to a PCB assembly. These products demand high levels of skill, precision, accuracy, and consistency. There is considerable in-house experience producing mechanical assemblies. They have such a high level of moving parts, so we refer to them as "machines" rather than products.

The awareness of critical engineering tolerances and the use of mechanical tools and gauges is key when producing moving mechanical assemblies of this complexity. Our skills-base also extends to testing mechanical and pneumatic assemblies. Following rigorous approval processes, our supply chain partners for custom parts – such as plastics, machined and fabricated metalwork – are monitored for quality and delivery performance. Tight control of the material supply chain ensures that, as with electronic parts, the availability of high-quality mechanical parts is maintained for timely production.

Many of the large-format assemblies produced by ESCATEC need wire and cable interconnection between boards and sub-assemblies. This can be via cable forms or point-to-point wiring.

As part of our electro-mechanical assembly service, we are often called on to produce machines that require critical cable routing, so that the moving parts may function. We also undertake electrical wiring of switch and instrument panels, as well as sophisticated control cabinets. These are all essential requirements for many of our customers. This activity reflects the same standards of accuracy and consistency as our PCB and mechanical assembly work.

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Test Solutions

When you partner with ESCATEC you immediately benefit from the knowledge and expertise of qualified test technicians and engineers who are well versed in flying probe and in-circuit testing, in addition to being able to implement customer functional test solutions, complemented by conventional bench test equipment and XTJAG boundary scan.

Flying probe testing

Flying probe testing is a popular solution for manufacturers working with smaller batch sizes. It is also frequently used when fixed test probe access is limited or impractical. A proven method of electronics manufacturing defect detection and prevention, flying probe testing also eliminates the requirement for dedicated fixturing.

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Flying probe testing uses a set of precision moveable test probes that directly access test points, vias, component pads, circuit interconnections and fine pitch parts. This means the technique is able to replace the need for a mechanical test fixture while also achieving test coverage similar that exhibited by in-circuit test (ICT).

  • Initial test program creation is fast & direct from CAD files
  • Removes need for bed-of-nails test fixture
  • Enables easy inspection of any PCB assembly
  • Ideal for low & medium volumes in addition to high board mix prototype applications

In-circuit test

ESCATEC offers full on-site in-circuit test, both analogue and digital, with vector-less test. Test fixtures and programmes are also produced on-site. For slightly larger volumes ICT is invaluable as a pre-cursor to functional test, reducing debug time and significantly increasing functional test yield.

Boundary scan

Boundary scan test is renowned as an extremely rapid test method, equipping manufacturers to debug and programme complex digital circuits. Our team uses cutting edge technologies from the likes of X-JTAG to deliver powerful Boundary Scan solutions. 

Ideal for testing boards populated with complex ICs, boundary scan processes deliver in-circuit levels of test coverage and diagnostics. Access purely from the board edge, this is an extremely useful and non-intrusive test technology. In addition, most modern devices feature bus technology which effectively creates thousands of test points to test components and interconnections. Boundary scan testing is the perfect way to identify structural fault locations, even beneath BGAs, without requiring mechanical access to the circuit.

Boundary scan benefits include:

  • Accelerate new product development
  • Reduce time-to-market
  • Fast & efficient test program generation is ideal for boards undergoing design revisions
  • Highly versatile; can be used across the board production process for design verification, in-system programming, testing & debugging

Functional test

Functional test is a core component of the majority of successful test strategies. While it is often possible to de-skill functional testing, it is also often the case that functional test makes the highest demands on a skills base in terms of diagnostics. 

We have considerable expertise in designing and delivering efficient test and diagnostic solutions. Our experienced and highly qualified test engineers can develop functional test solutions in-house, or work with those provided by our customers.

All functional PCB testing is fully supported by extensive engineering diagnostics so you can be sure that tested boards will be totally compliant with supplied specifications.

By using functional testing, our customers not only verify board functionality, but also, provide confirmation that the PCB will perform in its application environment.

RESOURCES

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If you’ve decided to outsource, this guide will give you the practical steps you need to take to select and transfer production to the right electronics manufacturing services (EMS) provider.

10 Critical Steps To Outsourcing Your Electronics Manufacturing (1)

Plastic Injection Moulding

ESCATEC offers new and existing customers a highly sophisticated in-house plastic injection moulding service. Available in both our Penang and Johor Bahru facilities in Malaysia, and in Plovdiv, Bulgaria. Each day thousands of complex plastic parts and components are produced to very high tolerances and supplied to demanding markets such as Medical and Automotive.

Our capabilities extend across the full range of injection moulding activities, including product design work, mould making and maintenance, testing and analysis, volume production, quality control, and delivery to the final user.

Collectively in Penang and Johor Bahru, ESCATEC has over 120 staff dedicated to this capability running a total of x57 1K horizontal machines, x3 2K horizontal machines, and x4 1K vertical machines, ranging in size from 15 to 460 tonnes.

Our in-house plastic injection moulding services offer customers: 

  • Reduced time to market
  • Ability to control costs better
  • Increased quality
  • Seamless transition to volume manufacturing
  • Removal of third-party supply partners
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Order Fulfilment

Outbound Logistics

To support the bespoke service level agreements we have in place for our customers, we offer a wide range of outbound logistics solutions to guarantee products are delivered on time and in full.

Our customers benefit from our custom packaging solutions we design together with you to guarantee the safe delivery of high precision electronic and electro-mechanical products.

In addition to next day delivery, we can also satisfy your "same day shipment" requirements through our dedicated couriers. Alternatively, where increased levels of flexibility are needed – for instance, configured-to-order products or products that require shipping with spares/accessories – we have demonstrable experience in product marshalling and managing consolidated shipments to site.

Postponement Manufacturing

For some customers, postponement manufacturing is the best way to meet demand forecasting challenges.

With our late-stage configuration and configure-to-order manufacturing services, we ensure our customers can respond rapidly to opportunities as and when they occur.

This truly agile supply chain service harnesses our postponement manufacturing expertise and outbound logistics capabilities, including direct shipment. For our OEM customers with highly configurable products, these late-stage configuration and postponement techniques will alleviate demand forecasting challenges. 

postponement manufacturing

Proven to deliver high levels of product differentiation and supply chain efficiency, the postponement of final product assembly until customer demand is clearly defined means that our customers can react rapidly and more effectively to opportunities as they arise.

Postponement manufacturing is a relatively simple theory, although it involves a high degree of collaboration and visibility throughout the supply chain. Our experienced team will manufacture a generic version of the product up to embryo level. We then hold this in inventory until the customer sends instructions to progress. The final product is then configured and packaged, which is directly linked to customer demand. The postponement manufacturing process is highly responsive, enabling customers to rapidly configure different variations/options along with the appropriate accessories, packaging and instruction manuals for the product and the country it is being shipped to.