ESCATEC in the News
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Taking to the skies
The global drone market continues to grow at a phenomenal rate. From insurance to construction to farming, just about every industry is rethinking the way they work. Real-time data collected by drones and the analysis of these insights help organisations make the right decisions faster. The possibilities are endless and the market is on the verge of a global boom. Experts estimate that by 2050, the industrial drone fleet in Europe and the US will comprise more than 1 million units and generate $50 billion per year in product and service revenues.
NPI and Industrialisation
Leveraging know-how for the customer’s success
The world’s best-selling tea brand, and part of a Fortune 500 company, decided to offer tea drinkers a quick and easy way to brew their daily cuppa by creating a single serve tea brewing machine. An external engineering company was selected to develop and design the machine and ESCATEC was contracted to manufacture the product.
NPI and Industrialisation
From idea to reality: 3D printer effectively moves design phase forward
ESCATEC’s recent investment in a Stratasys 3D printer has provided a decisive advantage in flexibility and ease when designing and developing customer products. A variety of colours and materials can be combined to create highly realistic and detailed prototypes for ESCATEC’s Design & Development (D&D) engineers and our customers. The 3D printer can quickly turn design concepts into easy-to-understand models that bring customer ideas to life.
It’s all in the details: The right PCB encapsulation adds value
By applying the right glue sealing solution, customers can increase reliability and extend the life of their electronic product. ESCATEC, leading providers of electronic manufacturing services, explains how. Reviewing the details of how a product is built can result in significant value for your end customers. When optimised, these small, yet important details, can transform a good product into a great one. A leading OEM of military products contacted the MICRO OPTICAL ELECTRONIC MECHANICAL SYSTEM (MOEMS) Facility at ESCATEC’s Swiss plant to develop a stable gluing solution for its products. With its highly regarded encapsulation methods for Chip-on-Board technology, the MOEMS Facility took on the challenge. Conventional glues used to manually fix components to pads on PCBs are not durable enough to withstand the shock and vibration military products demand. PCB-mounted components using such glues easily dislodge just by dropping the product. Imagine what the extreme shock and vibrations experienced by military products could result in.
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